low profile power inductors C l252010sf series proprietary and confidential document of superworld 25 / 0 4 /201 6 p 1 1. part no. expression : l 2 5 2 0 1 0 s f r 3 3 m a (a ) (b) (c) (d) (e) (f) (a) series c ode (d) inductance code (b) dimension c ode (e ) tolerance code (c) material c ode (f) internal controlled code 2. c onfiguration & d imensions : unit: mm 3. s chematic a b c d l g h 2.50.2 2.00.2 1.0 max 0.60.3 2. 8 1.2 2.0 h recommended pcb pattern l g h
low profile power inductors C l252010sf series proprietary and confidential document of superworld 25 / 0 4 /201 6 p 2 4. general specification 5. e lectrical c haracteristics 6. characteristics curve (a) test freq. : l : 1 m hz/0 .1 v (b) operating temp. : - 40c to +12 5c (inclusive of coil temp rise) (c) storage temp. : - 40c to +12 5c (d) humidity range : 852 % rh (e) heat rated current (irms) will cause the coil temperature rise t of max. 40c (keep 1min) (f) saturation current (isat) will cause l/ l0 a to drop Q 3 0% . (g) part temperature (ambient+temp. rise) : should not exceed 1 2 5c under worst case operating conditions. (h) storag e condition (component in its packaging) i) temperature: less than 40c ii) humidity : 60% rh part number inductance (uh) dcr ( ) i sat (a) max. i rms (a) max. m ax. t yp. l252010sfr24ma1 0.2420% 0.040 0.024 7.5 4.5 l252010sfr33ma1 0.3320% 0.042 0.030 5.6 3.5 l252010sfr47ma1 0.4720% 0.046 0.036 5.2 3.1 L252010SFR68MA1 0.6820% 0.065 0.049 3.8 2.9 l252010sf1r0ma1 1.020% 0.078 0.060 3.4 2.5 l252010sf1r5ma1 1.520% 0.105 0.082 3.2 2.2 l252010sf2r2ma1 2.220% 0.156 0.130 2.6 1.4
low profile power inductors C l252010sf series proprietary and confidential document of superworld 25 / 0 4 /201 6 p 3 7. soldering 7 - 1: soldering mildly activated rosin fluxes are preferred. the minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. our terminations are suitable for all re - flow soldering systems. if hand soldering cannot be avoide d, the preferred technique is the utilization of hot air soldering tools. note: - if wave soldering is used, there will be some risk. - reflow soldering temperatures below 240 c , there will be non - wetting risk. 7 - 2: solder re - flow: recommended temperature p rofiles for re - flow soldering in figure 1 7 - 3 : soldering iron (figure 2): products attachment with soldering iron is discouraged due to the inherent process control limitations. in the event that a soldering iron must be employed the following precautions are recommended. note: a) preheat circuit and products to 150 c b) 355 c tip temperature (max.) c) never contact the ceramic with the iron tip d) 1.0mm tip diameter (max.) e) use a 20watt soldering iron with tip diameter of 1.0mm f) limit soldering time to 4 - 5 sec
low profile power inductors C l252010sf series proprietary and confidential document of superworld 25 / 0 4 /201 6 p 4 8. packaging information: 8 - 1 reel dimension 8 - 2 tape dimension 8 - 3 packaging quantity chip size l 2 520 10 chip/reel 3 000 type a(mm) b(mm) c(mm) d(mm) 7x8mm 9.00.5 602 13.50.5 1782 size bo(mm) ao(mm) ko(mm) p(mm) t (mm) l2 52010 2.710.1 2.230.1 1.150.1 4.00.1 0.230.05
low profile power inductors C l252010sf series proprietary and confidential document of superworld 25 / 0 4 /201 6 p 5 9 - 4 : tearing off force application notice: 1. stor age conditions: to maintain the solderabililty of terminal electrodes: a) r ecommended p roducts should be used withi n 12 m onths from the time of delivery. b ) the packaging material should be kept where no chlorine or sulfur exists in the air. 2. transportation: a) products should be handled with care to avoid damage or cont amination from perspiration and skin oils. b) vacuum pick up is strongly recommended for individual components. c) bulk handling should ensure that abrasion a nd mechanical shock are minimized. the force for te aring off cover ta pe is 15 to 6 0 grams in the arrow direction under the following conditions . room temp. ( ) room humidity (%) room atm (hpa) tearing speed mm/min 5~35 45~85 860~1060 300
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